太阳能用晶体硅片切割技术Crystalline silicon wafer cutting technology for solar energy
蔡先武,明亮,黄美玲,李小鹏,彭海英,何远湘
摘要(Abstract):
介绍了太阳能用晶体硅片切割技术的发展历史,简要分析了外圆切割、内圆切割和砂浆钢线切割技术,详细阐述了当前主流的金刚线切割技术,分析其相应设备及工艺技术的现状和发展趋势,并对未来的硅片切割技术进行了展望。
关键词(KeyWords): 太阳能;硅片;切割技术;发展
基金项目(Foundation):
作者(Author): 蔡先武,明亮,黄美玲,李小鹏,彭海英,何远湘
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